Characterization of Integrated Circuit Packaging Materials - download pdf or read online

By Thomas Moore

ISBN-10: 0750692677

ISBN-13: 9780750692670

Chapters during this quantity deal with vital features of IC programs. Analytical options acceptable for IC package deal characterization are proven via examples of the dimension of serious functionality parameters and the research of key technological difficulties of IC programs. concerns are mentioned which impact numerous package deal kinds, together with plastic surface-mount applications, airtight applications, and complex designs similar to flip-chip, chip-on-board and multi-chip models.

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Extra info for Characterization of Integrated Circuit Packaging Materials

Example text

1, the calculated values of the work of adhesion, Wa, between the Cu-110 and various mold compounds are listed. 3, these are computed from their respective γ and γ values. 4 MC-100 101 102 (C) 103 104 (a) Tab pull, ib) button shear, and (c) 180° peel strengths are compared for various mold compounds. worthwhile to check the thermodynamic prediction that higher work of adhesion represents greater adhesive strength. 1 are measured by three different test methods. All three techniques seem to distinguish the weakest from the strongest adhesion sample but not samples of intermediate strengths.

17. 5 H. Moltzan and G. Bednarz. Texas Instruments Technical Journal. /Oct. 1988. 6 D. Danielson, G. Marcyk, E. Babb, and S. Kudva. 27th International Reliability Physics Sym. 1989, p. 114. 7 L. C. Wagner, S. Boddicker, P. D. Ngo, D. H. Morgan, and T. Myers. "New Technology in Electronic Packaging," ASM International. 1990, p. 353. 8 S. M. Kudva and E. Knudson. International Sym. for Testing and Failure Analysis. 1986, p. 1. 9 T. M. Moore, R. McKenna, and S. Kelsall. 29th International Reliability Physics Sym.

4 T. A. Anderson and K. L. Evans. International Sym. for Testing and Failure Analysis. 1986, p. 17. 5 H. Moltzan and G. Bednarz. Texas Instruments Technical Journal. /Oct. 1988. 6 D. Danielson, G. Marcyk, E. Babb, and S. Kudva. 27th International Reliability Physics Sym. 1989, p. 114. 7 L. C. Wagner, S. Boddicker, P. D. Ngo, D. H. Morgan, and T. Myers. "New Technology in Electronic Packaging," ASM International. 1990, p. 353. 8 S. M. Kudva and E. Knudson. International Sym. for Testing and Failure Analysis.

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Characterization of Integrated Circuit Packaging Materials by Thomas Moore


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