Download e-book for kindle: Materials for Rigid and Flexible Printed Wiring Boards by Martin W. Jawitz

By Martin W. Jawitz

ISBN-10: 082472433X

ISBN-13: 9780824724337

Advanced digital circuits and units are flooding functions in approximately each aspect of industrial and business job, from computerized gear to all kinds of patron items. right choice of fabrics is essential to fulfill the end-use standards of versatile and inflexible revealed wiring forums. whereas there are numerous beneficial books and articles at the fabrication of revealed circuit forums, fabrics for inflexible and versatile published Wiring forums is the 1st e-book to aspect the homes of the fabrics used and the way they're made.

The authors current very important production details and fabric homes for reinforcement fabrics, resins, versatile motion pictures, copper foils, inflexible laminates, high-speed/high-frequency laminates, and steel middle and constraining center fabrics. they provide functional counsel to assist designers, engineers, and fabricators opt for appropriate fabrics to effectively meet energy, weight, thickness, functionality, fee, and different requisites. in general, the fabric info comes at once from brands' information sheets, representing average values. The booklet illustrates the comparative strengths and boundaries of the fabrics, highlights their easy homes, and info the producing approaches used to make them.

Offering useful tips in accordance with years of expertise, fabrics for inflexible and versatile revealed Wiring forums is a one-stop resource of an important details for an individual designing or development published circuit forums for any program.

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Additional resources for Materials for Rigid and Flexible Printed Wiring Boards (Electrical and Computer Engineering)

Example text

While these fibers were suitable for textile and some industrial end users, they offered limited strength and low melt point. In 1965, DuPont discovered a method for producing an almost perfect polymer chain using the polymer poly-p-benzamide. The key structural feature of this molecule is the para orientation of the benzene ring, which allows it to form rodlike structures with a simple repeating molecular structure. The term aramid now refers generically to organic fibers in the aromatic polyamide family.

2. 5. The two primary fabric styles used for printed wiring board laminates are styles 503 (which has limited availability) and 525 (which is the most commonly used). 6. 1 Moisture and Chemical Resistance Organic solvents, bacterial attack, or many acidic or basic corrosives do not affect the inorganic fibers. These fibers exhibit no appreciable water absorption or water-induced deterioration. 2 Electrical Properties Glass is an electrical insulator with high Dk and relatively low Df. Its low moisture absorption also contributes to very stable electrical characteristics.

1. Bolin, Spinning a glass yarn, PC Fab, Dec. 1983. Maher, Polyimide Quartz, A Chip Carrier Compatible Laminate Material, IPC Meeting, Sept. 1982. Norplex, Technical Bulletins #1005. Owens-Corning Fiberglass, Yarns. PPG Industries, Fiberglass Yarns Product Handbook. 0 Introduction The resin systems that are used today to produce printed circuit laminates vary with the design requirements, intended application, end item requirements, and cost. , automotive, appliances, toys) that do not require high-performance resins, the board manufacturer will usually use the lowest-cost resin system.

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Materials for Rigid and Flexible Printed Wiring Boards (Electrical and Computer Engineering) by Martin W. Jawitz

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