Micro-Relay Technology for Energy-Efficient Integrated - download pdf or read online

By Hei Kam

ISBN-10: 1493921274

ISBN-13: 9781493921270

ISBN-10: 1493921282

ISBN-13: 9781493921287

This quantity describes the layout of relay-based circuit platforms from gadget fabrication to circuit micro-architectures. This booklet is perfect for either machine engineers in addition to circuit procedure designers, and highlights the significance of co-design throughout layout hierarchies whilst attempting to optimize method functionality (in this situation, energy-efficiency). The booklet also will attract researchers and engineers all in favour of semiconductor, built-in circuits, and effort effective electronics.

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Extra resources for Micro-Relay Technology for Energy-Efficient Integrated Circuits

Sample text

Thus, expensive vacuum packaging may not be necessary. 8 2 Design and Modeling of Micro-relay Relay Energy Consumption per Operation The energy consumed in switching a relay is supplied by the voltage source which charges/discharges capacitances. These include the capacitance associated with the actuation air gap, εoA/(g-gd), and the fixed parasitic capacitance C. g. due to wire routing). Assuming an area proportionality factor r and an average relay activity factor aavg, the switching energy of a relay can be modeled by Eq.

It has been shown that Q decreases linearly with beam thickness and is independent of beam width and beam length [13, 14]. Therefore, it is reasonable to treat Q as a technology-dependent constant. Also, since α, β and γ saturate quickly for Q values greater than ~1, Q values significantly higher than 1 are not necessary for high performance. In fact, it may be preferable to avoid highQ relay designs to minimize non-ideal switching effects such as contact bounce and long settling time. Thus, expensive vacuum packaging may not be necessary.

Evoy, L. G. M. Parpia, Measurement of mechanical resonance and losses in nanometer scale silicon wires. Appl. Phys. Lett. 1 Introduction Chapter 2 presented the design and modeling of micro-relays for logic applications. 6 surface micromachining process [1, 2]. The experimental results presented herein are used for relay model calibration, and provide a necessary background for the discussions on design optimization and scaling in Chap. 5. Next, we also present the results of various prototype relay technology recently developed in various research laboratories.

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Micro-Relay Technology for Energy-Efficient Integrated Circuits by Hei Kam


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